MPP iBond 5000

MPP (Micro Point Pro) iBond 5000 convertible ball-and-wedge wire bonder, switchable between ball and wedge modes on a single tool. Bonds gold and copper wire in ball mode and aluminium wire in wedge mode, and supports gold ribbon; the wedge configuration offers a 5.3 x 5.3 inch bonding area. Touchscreen control with heated workstage, suited to R&D and small-scale packaging.