Unavailable until 26 Oct, 12:30
Bay 15 Translational Research Hub
Internal name
SCRIBE02
Process types
Packaging and Back End Processing
Description
ATV precision manual diamond scriber for scribe-and-break separation of semiconductor wafers, glass and ceramic substrates. Fine X and rotational adjustment with a vacuum chuck and cross-hair microscope aligned to the scribe trace, plus adjustable tool angle, force and touch-down points for repeatable scribing prior to cleaving.