ADT 7900 DUO 8" dicing system

ADT 7900 DUO automatic dual-spindle dicing saw for high-throughput die singulation of wafers and substrates up to 8 inch (200mm). Two facing spindles dice simultaneously to double productivity, with an automated vision system for alignment, Y-offset correction and kerf checking. Handles IC wafers plus hard materials such as glass, quartz, sapphire and ceramics.