A modular system for photoresist coating of wafers, featuring the following components: RCD8 semi-automated spin coater: Standard wafers up to 200mm; square substrates up to 150mm x 150mm Edge bead removal and back-side rinse functionality Automated dispense options and programmable recipes HP8 200mm hotplate (x2): Quickstart and programmable recipe options Homogeneous temperature distribution Optional nitrogen environment and hotplate vacuum VP8 Vapour Primer: Programmable surface conditioner for application of HDMS
Resist Coat and Develop