Equipment Information

• Internal Name: MA08

Description

Semi-automated mask and bond aligner with diffraction-reducing optics. UV-LED array: 365nm (i-line), 405nm (h-line), 436nm (g-line) Mask sizes: 100mm, 150mm, 200mm Wafer sizes: 100mm, 150mm, 200mm Top-side, bottom-side and infrared alignment. DirectAlign® allows for 0.5µm alignment (0.25µm with COGNEX® pattern recognition) Proximity lithography and soft/hard/vacuum contact exposure Resolution down to sub-micron scale Wedge error correction with micrometric precision