Equipment Information

• Internal Name: EVAP07

Description

Loadlocked PVD system with Ar sputter clean preparation. Suitable for samples up to 150mm wafer size, with thermal and e-beam capabilities. Able to evaporate the following materials using e-beam evaporation: Gold, Titanium, Aluminium, Platinum, Nickel. Able to evaporate the following materials using thermal evaporation: Gold/Germanium, Gold. Please inform ICS staff of the required materials at least 24 hours prior to deposition, so that the process chamber can be prepared in advance (use notes section of booking). Due to the loadlock, sample loading is quick.