Equipment Information
Buehler Syrus LC 3 · Dielectric Evaporator and Sputter Coater
- Internal Name: EVAP06
Description
Open-chamber PVD system suitable for samples up to 200mm wafer size, with sputter and e-beam capabilities. Able to evaporate the following materials using sputtering: Silicon Nitride. Able to evaporate the following materials using e-beam: Silicon Dioxide, Tantalum Oxide. Requires time to pump the sample down from atmosphere before the sample is ready for deposition - allow 3 hours. Please ensure you inform ICS staff of the required materials to be deposited before you are ready to load your sample (use notes section of booking).
Process Type(s)
Physical Vapour Deposition
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