Unavailable until 26 Oct, 12:30
Bay 15 Translational Research Hub
Internal name
DieSep
Process types
Packaging and Back End Processing
Description
The SPS/Ultron UH130 die matrix expander stretches dicing tape on film frames up to 300mm to separate singulated dies into an evenly spaced matrix for pick-and-place or die bonding. A heated ram with digital temperature control and adjustable stroke height and speed keeps die orientation and spacing consistent for repeatable results.
